A Compact Model with Self-Heating Effect Applying to the SCR Device for ESD Protection

This work develops a novel compact Silicon-Controlled Rectifier (SCR) model incorporating self-heating effects, extending the conventional Ebers–Moll (E–M) framework for Bipolar Junction Transistors (BJTs) by comprehensively integrating parasitic effects. The temperature dependence of critical device parameters, including junction capacitances, emitter resistances, and saturation currents, is systematically characterized to accurately predict the device’s electrical behavior under Electrostatic Discharge (ESD) stress. Furthermore, a self-heating modeling approach is introduced based on the SCR layout characteristics. The impact of self-heating on SCR transient response was verified by comparing simulation results with measurements from SCR devices fabricated in a 0.18 µm Bipolar-CMOS-DMOS (BCD) process. Comparative analysis demonstrates superior accuracy over existing models. The proposed SCR model includes a complete definition of parameters and electrical relationships, ensuring compatibility with various Electronic Design Automation (EDA) platforms.

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Publication Details

Journal
Electronics
Published
2025-02-21
DOI
https://doi.org/10.3390/electronics14050843
Citations
1
Primary Topic
Electrostatic Discharge in Electronics
Type
article
Field-Weighted Citation Impact
0.73

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article

A Compact Model with Self-Heating Effect Applying to the SCR Device for ESD Protection

Hailian Liang, Junliang Liu, Hongkun Wang
1 citations
Electronics
Electrostatic Discharge in Electronics
0.73
article

A Compact Model with Self-Heating Effect Applying to the SCR Device for ESD Protection

Hailian Liang, Junliang Liu, Hongkun Wang
article en
1 citations

Abstract

This work develops a novel compact Silicon-Controlled Rectifier (SCR) model incorporating self-heating effects, extending the conventional Ebers–Moll (E–M) framework for Bipolar Junction Transistors (BJTs) by comprehensively integrating parasitic effects. The temperature dependence of critical device parameters, including junction capacitances, emitter resistances, and saturation currents, is systematically characterized to accurately predict the device’s electrical behavior under Electrostatic Discharge (ESD) stress. Furthermore, a self-heating modeling approach is introduced based on the SCR layout characteristics. The impact of self-heating on SCR transient response was verified by comparing simulation results with measurements from SCR devices fabricated in a 0.18 µm Bipolar-CMOS-DMOS (BCD) process. Comparative analysis demonstrates superior accuracy over existing models. The proposed SCR model includes a complete definition of parameters and electrical relationships, ensuring compatibility with various Electronic Design Automation (EDA) platforms.

ElectronicsVol. 14(5)
Jiangnan University (CN)
Fundamental Research Funds for the Central Universities
Affordable and clean energy
Openalex Percentile: Top 31%
Electrostatic Discharge in Electronics
0.73
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