Helium nano-bubbles in copper thin films slows down creep under ion irradiation

Authors

Publication Details

Journal
Acta Materialia
Published
2025-02-21
DOI
https://doi.org/10.1016/j.actamat.2025.120854
Citations
3
Primary Topic
Fusion materials and technologies
Type
article
Field-Weighted Citation Impact
1.55

Funders

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article

Helium nano-bubbles in copper thin films slows down creep under ion irradiation

Thomas Pardoen, Michaël Coulombier, Nargisse Khiara, F. Onimus et al.
3 citations
Acta Materialia
Fusion materials and technologies
1.55
article

Helium nano-bubbles in copper thin films slows down creep under ion irradiation

Thomas Pardoen, Michaël Coulombier, Nargisse Khiara, F. Onimus, Jean‐Pierre Raskin, Y. Bréchet
article en
3 citations

Abstract

No abstract available for this paper.
Acta MaterialiaVol. 288
Université Catholique de Louvain, Agence Nationale de la Recherche
Openalex Percentile: Top 20%
Fusion materials and technologies
1.55
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Helium nano-bubbles in copper thin films slows down creep under ion irradiation — Thomas Pardoen, Michaël Coulombier, et al. · Acta Materialia (2025) | TGRS Research Map | TGRS