Process sensitivity analysis for EPE optimization of MP18 SALELE BEOL patterning

In this work, we estimated the edge placement error (EPE) and demonstrated the feasibility of patterning an advanced 18-16 nm metal pitch (MP) BEOL using the SEMulator3D® virtual fabrication platform. The full 18 nm MP process flow patterned using a SALELE technique was simulated to evaluate three EPE challenges: LE1 on LE2, BL1 on LE1 and BL2 on LE2. We explored the impact of process variations and patterning sensitivities on EPE variability. The simulation identified significant process parameters and corresponding process windows that need to be controlled to ensure successful EPE control.

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Published
2025-02-21
DOI
https://doi.org/10.1117/12.3051089
Primary Topic
Advancements in Photolithography Techniques
Type
article
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article

Process sensitivity analysis for EPE optimization of MP18 SALELE BEOL patterning

Tom Mountsier, Assawer Soussou, Mircea Dusa, Gosia Jurczak et al.
Advancements in Photolithography Techniques
article

Process sensitivity analysis for EPE optimization of MP18 SALELE BEOL patterning

Tom Mountsier, Assawer Soussou, Mircea Dusa, Gosia Jurczak, Brett Lowe, Luka Kljucar
article en

Abstract

In this work, we estimated the edge placement error (EPE) and demonstrated the feasibility of patterning an advanced 18-16 nm metal pitch (MP) BEOL using the SEMulator3D® virtual fabrication platform. The full 18 nm MP process flow patterned using a SALELE technique was simulated to evaluate three EPE challenges: LE1 on LE2, BL1 on LE1 and BL2 on LE2. We explored the impact of process variations and patterning sensitivities on EPE variability. The simulation identified significant process parameters and corresponding process windows that need to be controlled to ensure successful EPE control.

IMEC (BE), Lam Research (United States) (US)
Openalex Percentile: Top 98%
Advancements in Photolithography Techniques
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