Process window analysis using dual layer overlap area between metal via pair

In this work, we leverage the functionalities of Large FOV SEM, a high-speed ebeam tool for both defect inspection and CD/EPE metrology application, to demonstrate an end-to-end flow and deliver a process window analysis using CD and overlap area between layers as key metrics. The main focus is to establish the overlap area metric as a reliable indicator of yield and therefore allow for characterization of FR (fail rate) and process margins (dose/focus/OVL) early in the flow.