Metal reduction from highly viscous microelectronics fluids

Various chemicals are used in high viscosity photo-resist applications. The metal content of these chemicals is a concern as diffusion into circuit components may contaminate wafers during both processing and post-processing. This can adversely affect performance over time. The high viscosity of these chemicals results in elevated pressure drop across porous media such as membranes or monoliths. A new monolith microstructure has been developed that enables the processing of high viscosity fluids for metal reduction while maintaining acceptable flow rates. Experiments were performed to compare flow rates and metal reduction of the monoliths, as well as metal reduction capacities. The results of metal reduction will be presented using the new monolith.