Design of a Heat Dissipation antenna for Wireless Power Transmission

This paper proposes a dielectric-free substrate heat dissipation antenna for high-power, high-efficiency wireless power transfer applications. The antenna consists of a radiating surface and a hollow thin-walled cylinder. The hollow thin-walled cylinder serves as both support and thermal conduction while introducing additional inductance to enhance the antenna's electromagnetic radiation. This results in a high-gain antenna that also functions as a heat sink for active devices. Simulation results indicate that the proposed 5.8 GHz heat dissipation antenna has a bandwidth of 100 MHz and a simulated gain of 10.10 dB. It can maintain the temperature of a chip with a thermal dissipation rate of 1 W at room temperature at $50^{\circ} \text{C}$ without any other cooling devices.