Heat Dissipation and Optimization for Satcom Active Phased Array Terminal

Active phased array (APA) terminal circuits are assembled with power supply modules and high-power consumption chips including RX/TX beamformer IC and DC/DC step-down chips on multi-layer PCB boards, which need to solve the heat dissipation problem of high heat flow density in a short time. This paper presents and compares a few different designs on heat sinks and proposes an optimization for Satcom active phased array. Based on phase change heat sink, optimizing the cavity structure of phase change material and adding a certain number of heat sink fins can greatly reduce the maximum temperature and high-low temperature difference of the circuit.