LTCC Based Antenna Microsystem Expandable Module with Wideband and Low-Profile for Satellite Communication

This article proposes a design scheme for a fourchannel X-band broadband, low-profile, highly integrated active phased array antenna expandable module. The design incorporates low-temperature co-fired ceramic (LTCC) and ball grid array (BGA) technologies to achieve a high level of integration between the antenna units and the transceiver channels. After processing and testing, the entire antenna microsystem expandable module measures $28.66 \mathrm{~mm} \times 36.5 \mathrm{~mm}$ with a thickness of only 5.65 mm. It operates across the entire Xband ($8-12 \mathrm{GHz}$) with an EIRP exceeding 43.4 dBm. This module offers wide frequency band coverage, low profile, lightweight design, and two-dimensional expandability, demonstrating promising engineering applications on satellite platforms.