Design of Broadband Vertically Coupling Transition Structures from Stripline to Stripline

This paper presents a cross-layer vertical coupling transition structure from stripline to stripline. The structure accomplishes electromagnetic coupling between the upper and lower stripline patches through square slots on the ground layer. It realizes the cross-layer transmission of microwave signals within multilayer dielectric boards including a liquid crystal board. The coupling transition structure is modeled in three-dimensional electromagnetic field simulation software. The simulation results show that the insertion loss is less than 3.7 dB in the frequency band from 6 GHz to 18 GHz.