Oxidation behavior and mechanism of GH5188 alloy foil <?A3B2 pi6?>at high temperature

<bold> </bold>The oxidation behavior of GH5188 alloy foil at temperatures ranging from 980 to 1150 ℃ was studied through isothermal oxidation experiments, X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscope (SEM), and energy dispersive spectrometer (EDS). The results indicate that the oxidation kinetics of the alloy foil material follows a parabolic pattern and exhibits two stages of oxidation kinetics. After oxidation, a double-layer oxide film is formed on the surface of the alloy foil material, with the outer layer being MnCr₂O₄ spinel and the inner layer being Cr₂O₃. SiO₂ is discontinuously distributed at the pores at the interface between the oxide layer and the substrate. Due to the consumption of the Cr element, a non-carbide precipitation zone is formed inside the foil material, which continues to deepen. With the increase of oxidation temperature and oxidation time, cracks are formed in the Cr₂O₃ layer due to thermal stress and growth stress, and continue to propagate, resulting in layered peeling of the oxide layer.