Recent development in photonic integration

This study takes an in-depth look at advances in photonic integration, examining the main materials used in photonic integrated circuits (PICs) - Indium Phosphide (InP), Silicon Photonics (SiP), Silicon Nitride (SiN), and polymer thin films - separately. In this article, the advantages and limitations of each platform are evaluated and compared in details. Finally, the article provides an outlook on the future applications of PICs, predicting a wide range of applications in emerging areas such as virtual reality, quantum computing, sensing and RF systems. The analysis shows that the preference for material platforms varies according to specific market needs.