Low Loss Chip‐to‐Chip Couplers for High‐Density Co‐Packaged Optics
Co-Packaged Optics In article number 2402095, Drew Weninger, Samuel Serna, and co-workers present a co-packaged optics system with an electrical chip (black, center) surrounded by 8 silicon photonic chips. Chips are bonded using an automated pick-and-place tool, shown placing the final chip into position. The automation is enabled by a novel optical chip-to-chip coupler (green callout).
Authors
- Samuel Serna (ORCID: https://orcid.org/0000-0003-0269-0589)
- Drew Weninger (ORCID: https://orcid.org/0009-0003-5334-2426)
- Luigi Ranno (ORCID: https://orcid.org/0000-0002-8444-3022)
- Lionel C. Kimerling (ORCID: https://orcid.org/0000-0002-3913-6189)
- Anu Agarwal (ORCID: https://orcid.org/0000-0001-5264-1123)
Institutions
- Bridgewater State University (US)
- Massachusetts Institute of Technology (US)
Publication Details
- Journal
- Advanced Engineering Materials
- Published
- 2025-02-01
- DOI
- https://doi.org/10.1002/adem.202570012
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00