In-Situ Fault Sensing Methods for Degradation Mechanism of SiC Power MOSFETs in Power Supplies Under Power Cycling Stress
This paper investigates a fault sensing method for SiC power MOSFETs in power supply based on voltage transient. The impact of SiC power MOSFETs degradation on voltage transient have been theoretically analyzed. The effect of the degradation is represented by the voltage changing rate measured by a RF voltage probe with a noninvasive manner. The degraded devices were obtained through the power-cycling test, and a BOOST circuit is used to simulate the real working environment and conditions. We extracted voltage changing rate of SiC power MOSFETs when SiC power MOSFETs were working, and compared the changes in voltage changing rate before and after degradation. The feasibility of the fault sensing method was verified by experimental results. The results may aid in the degradation monitoring of SiC power MOSFETs in power supply, thereby improving the safety of power supply operations.
Authors
- H. N. Long (ORCID: https://orcid.org/0000-0002-5433-4415)
- Changjian Zhou (ORCID: https://orcid.org/0000-0002-7156-348X)
- Yiqiang Chen (ORCID: https://orcid.org/0000-0001-6814-8181)
- Bo Hou (ORCID: https://orcid.org/0000-0002-4030-0716)
Institutions
- Ministry of Industry and Information Technology (CN)
- South China University of Technology (CN)
Publication Details
- Published
- 2024-10-11
- DOI
- https://doi.org/10.1109/phm-beijing63284.2024.10874635
- Citations
- 2
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.42
Funders
- National Natural Science Foundation of China
- Guangdong Provincial Applied Science and Technology Research and Development Program