Life Prediction of BGA Solder Joints in Ceramic SIP-3D Packaging Under Temperature Cycling

With the development of electronic packaging technology towards miniaturization, low cost, and high integration, system in package (SIP) has become a key technology in the fabrication of electronic devices. However, the miniaturization of electronic packaging also brings some reliability issues. Such as the cracking problem of BGA solder joints under temperature cycling conditions. In this paper, a system integration package (SIP) was proposed based on ceramic package, which can achieve high integration while also achieving hermetic package. The lifetime of BGA solder joints under temperature cycling was studied through experimental and simulation methods. the experimental results were consistent with the simulation results. This package provides a solution for miniaturization of SIP.