High-Performance Enhancement-Mode GaN p-FET Fabricated With an Etch-Stop Process
The gate recess process for the enhancement-mode (E-mode) gallium nitride (GaN) p-FET is expected to create a high density of crystalline defects; thus, a large <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\vert {V}_{\text {th}} \vert $ </tex-math></inline-formula> is often accompanied with a poor I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>. To address this challenge, in this work, an etch-stop process is developed with a 1.5-nm AlN layer inserted in the p-GaN layer, so the dry-etch-based gate recess is terminated at the AlN layer. The AlN at the recess region is then removed using a wet etch, so the surface of the gate channel is shielded from the plasma bombardment during the dry etch. The fabricated etch-stop GaN p-FET demonstrates an E-mode operation with a large <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}} = -4.9$ </tex-math></inline-formula> V, a high I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small> of 6.79 mA/mm, a small <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}}$ </tex-math></inline-formula> hysteresis of 0.2 V, and a high I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>/I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small> ratio of 106. Furthermore, an E-mode n-channel FET was fabricated on the same epitaxial wafer to demonstrate the potential of the proposed etch-stop p-FET technology for GaN complementary logic (CL). Therefore, the technology demonstrated in this work is proved an effective approach to address the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}}$ </tex-math></inline-formula>–I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small> tradeoff in the GaN p-FET for CL applications.
Authors
- Hengyuan Qi
- Shiwei Feng (ORCID: https://orcid.org/0000-0001-9038-8309)
- Teng Li (ORCID: https://orcid.org/0009-0000-8259-134X)
- Jingjing Yu (ORCID: https://orcid.org/0000-0002-0301-3312)
- Jiawei Cui (ORCID: https://orcid.org/0000-0001-6000-1505)
- Maojun Wang (ORCID: https://orcid.org/0000-0002-9078-6961)
- Junjie Yang (ORCID: https://orcid.org/0000-0003-3614-7306)
- Han Yang (ORCID: https://orcid.org/0009-0008-8475-7049)
- Meng Zhang (ORCID: https://orcid.org/0000-0001-9868-6431)
- Jin Wei (ORCID: https://orcid.org/0000-0001-6124-0110)
- Yamin Zhang (ORCID: https://orcid.org/0000-0001-5001-4329)
- Sihang Liu (ORCID: https://orcid.org/0000-0001-8844-6792)
- Bo Shen (ORCID: https://orcid.org/0000-0003-2786-8400)
- Yunhong Lao (ORCID: https://orcid.org/0009-0003-0537-7931)
- Xuelin Yang (ORCID: https://orcid.org/0009-0006-2316-1271)
Institutions
- Peking University (CN)
- Beijing University of Technology (CN)
Publication Details
- Journal
- IEEE Transactions on Electron Devices
- Published
- 2025-02-18
- DOI
- https://doi.org/10.1109/ted.2025.3540053
- Citations
- 7
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 8.81
Funders
- National Key Research and Development Program of China