High-Performance Enhancement-Mode GaN p-FET Fabricated With an Etch-Stop Process

The gate recess process for the enhancement-mode (E-mode) gallium nitride (GaN) p-FET is expected to create a high density of crystalline defects; thus, a large <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\vert {V}_{\text {th}} \vert $ </tex-math></inline-formula> is often accompanied with a poor I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>. To address this challenge, in this work, an etch-stop process is developed with a 1.5-nm AlN layer inserted in the p-GaN layer, so the dry-etch-based gate recess is terminated at the AlN layer. The AlN at the recess region is then removed using a wet etch, so the surface of the gate channel is shielded from the plasma bombardment during the dry etch. The fabricated etch-stop GaN p-FET demonstrates an E-mode operation with a large <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}} = -4.9$ </tex-math></inline-formula> V, a high I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small> of 6.79 mA/mm, a small <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}}$ </tex-math></inline-formula> hysteresis of 0.2 V, and a high I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>/I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small> ratio of 106. Furthermore, an E-mode n-channel FET was fabricated on the same epitaxial wafer to demonstrate the potential of the proposed etch-stop p-FET technology for GaN complementary logic (CL). Therefore, the technology demonstrated in this work is proved an effective approach to address the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}}$ </tex-math></inline-formula>–I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small> tradeoff in the GaN p-FET for CL applications.

Authors

Institutions

Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-02-18
DOI
https://doi.org/10.1109/ted.2025.3540053
Citations
7
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
8.81

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

High-Performance Enhancement-Mode GaN p-FET Fabricated With an Etch-Stop Process

Hengyuan Qi, Shiwei Feng, Teng Li, Jingjing Yu et al.
7 citations
IEEE Transactions on Electron Devices
GaN-based semiconductor devices and materials
8.81
article

High-Performance Enhancement-Mode GaN p-FET Fabricated With an Etch-Stop Process

Hengyuan Qi, Shiwei Feng, Teng Li, Jingjing Yu, Jiawei Cui, Maojun Wang, Junjie Yang, Han Yang, Meng Zhang, Jin Wei, Yamin Zhang, Sihang Liu, Bo Shen, Yunhong Lao, Xuelin Yang
article en
7 citations

Abstract

The gate recess process for the enhancement-mode (E-mode) gallium nitride (GaN) p-FET is expected to create a high density of crystalline defects; thus, a large <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\vert {V}_{\text {th}} \vert $ </tex-math></inline-formula> is often accompanied with a poor I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>. To address this challenge, in this work, an etch-stop process is developed with a 1.5-nm AlN layer inserted in the p-GaN layer, so the dry-etch-based gate recess is terminated at the AlN layer. The AlN at the recess region is then removed using a wet etch, so the surface of the gate channel is shielded from the plasma bombardment during the dry etch. The fabricated etch-stop GaN p-FET demonstrates an E-mode operation with a large <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}} = -4.9$ </tex-math></inline-formula> V, a high I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small> of 6.79 mA/mm, a small <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}}$ </tex-math></inline-formula> hysteresis of 0.2 V, and a high I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>/I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small> ratio of 106. Furthermore, an E-mode n-channel FET was fabricated on the same epitaxial wafer to demonstrate the potential of the proposed etch-stop p-FET technology for GaN complementary logic (CL). Therefore, the technology demonstrated in this work is proved an effective approach to address the <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {th}}$ </tex-math></inline-formula>–I<sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small> tradeoff in the GaN p-FET for CL applications.

IEEE Transactions on Electron DevicesVol. 72(4)
Peking University (CN), Beijing University of Technology (CN)
National Key Research and Development Program of China
Openalex Percentile: Top 2%
GaN-based semiconductor devices and materials
8.81
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.