Ultra-low Loss Build-up Film Dielectric for Advanced Packaging

This paper introduces a novel low-loss film dielectric material and describes the performance of the material. As the demand for faster, smaller, and more energy-efficient electronic devices continues to surge, the IC substrates must have the capability of meeting the stringent requirements, especially to support high speed signal transmissions. As the signal frequencies increase, the importance of reducing dielectric loss is getting more critical in enhancing the performance of IC substrates. However, achieving ultra-low loss characteristics in build-up dielectric materials remains a formidable technical challenge, hindered by the inherent limitations of traditional epoxy-based materials. This paper introduces a novel build-up dielectric material that addresses the technical limitation of the conventional materials. Leveraging advanced material design and process technology, the new dielectric film material offers ultra-low electrical loss characteristics with robust reliability performance and standard manufacturing processes compatibility. The unique material design bestows extremely stable electrical performance at higher temperatures. Signal transmission measurement demonstrated that the new material exhibited approximately 40% lower transmission loss compared to the conventional material. The superior characteristics make the dielectric material ideal for advanced packaging in high performance computing, telecommunications, and evolving automotive applications.