Selecting Strip-Based or Singulated Laminates in Chiplet Packaging

Deciding whether to pursue strip-based or singulated laminate substrates for chiplet packaging has become more important as technological capabilities of both architectures have grown enough to overlap broadly. This paper investigates, analyzes, and prioritizes the factors that impact the relative suitability of laminate-based assembly options for chiplet-based and other advanced packaging. A mathematical model is constructed that compares assembly outputs such as cycle time, material usage and cost for a wide range of inputs, such as package body size, bill of materials and device functionality requirements. The two substrate architectures are compared over these parameters, and crossover points for each input parameter are calculated, delineating which architecture is best suited given any set of inputs.