Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration

In this study, the fan-out chip-last panel-level packaging in fabricating an ultra-large organic interposer of a hybrid substrate for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of a hybrid substrate (85 mm x 80 mm) with an ultra-large organic interposer (5 RDLs with the minimum metal line width (L) and spacing (S) = 2 μm) and a 5-2-5 build-up package substrate. Also, some recommendations are provided.