An Open Chiplet Ecosystem for Constructing System-in-Package with Universal Chiplet Interconnect ExpressTM (UCIeTM)

Chiplets connected on package, referred to as system-in-package (SiP), has become mainstream across the compute continuum. Universal Chiplet Interconnect expressTM (UCIeTM) is an open industry standard offering significant bandwidth, power-efficiency, and latency improvements over other interconnects. The entire industry has rallied behind UCIe and driving it forward to solve the challenges in computing while deploying UCIe for a wide range of usage models. UCIe is poised to enable innovations at the package level the way PCIe and CXL has driven innovation at the platform level.