An Innovative Approach for Advanced Packaging in 3D System Integration using Reconstructed Wafer-to-Wafer Bonding

Advanced package architecture and integration are among the most important technologies in high-performance HPC and AI systems of 3D system interconnection. This paper introduces an innovative approach for heterogeneous integration in a new 3D system called reconstructed wafer-to-wafer (W2W) for high-performance computing (HPC) and artificial intelligence (AI) systems. It discusses the package architecture, process flow, and 2um pitch bonding results of the reconstructed W2W technology. This approach utilizes advanced hybrid bonding technologies and offers several advantages, including high performance, efficient power delivery, high yield, and 3D system heterogeneous integration. It supports various architectures and can be configured flexibly according to system requirements, thereby improving the overall performance and efficiency of the system. Furthermore, it proposes a concept to recover alignment errors to enable the interconnection pitches of the integrated circuit package to be scaled down to sub-micron levels, significantly increasing the processing speed of the system.