Next Generation Phase Change Material for High Power Electronics

The demand to increase speed and performance of electronic devices while keeping the footprint small, has increased the power density of electronic devices beyond what we thought possible merely a decade back. Telecom/Datacom, Industrial, Automotive and Consumer electronics such as gaming console are pushing the package size to be greater than 70mm X 70mm and power density greater than 100W/cm2. Most electronic devices are running at high power with high frequency power cycles. This elevated power density and high frequency cycling causes the temperature to rise beyond the operating thresholds of the device. To achieve the functionality and reliability of these devices, proper thermal management must be employed. Research shows, use of Phase Change Material (PCM) in TIM 2 and TIM 1.5 applications is an interesting and effective technique in maintaining the temperature of advanced electronic devices to its desired target. Although PCM has been in the market for decades, the recent advancement in high power electronic is accelerating the development of next generation PCM as a desired solution to maintain electronic devices temperature. In this paper we will discuss some of the new developments in PCM with special focus on power electronics and Telecom/Datacom applications. Methods to characterize PCM and comparison of different PCM will also be discussed.