Enhancing Electrical Conductivity of Epoxy Resin Based Conductive Pastes Through the Use of NanoStrandTM Silver

This study investigates the enhancement of electrical conductivity in epoxy resin-based conductive adhesives through the incorporation of NanoStrand™ Silver, a one-dimensional silver nanoparticle. Traditional electrically conductive adhesives (ECAs) rely on micron-sized silver flakes to achieve conductivity, often requiring high filler concentrations that affect the viscosity and processability of the adhesive. By integrating NanoStrand Silver into the composite, we significantly reduced the percolation threshold, enabling high conductivity at lower total silver concentrations. The elongated structure of NanoStrand Silver promotes more efficient conductive networks, which resulted in similar or improved electrical performance compared to composites with only silver flakes. The addition of NanoStrand Silver increased the viscosity and thixotropy index of the adhesive, which makes the product suitable for industrial applications. Surface treatment of NanoStrand Silver further enhanced conductivity by reducing capping molecules that impede electron flow. These findings demonstrate the potential of NanoStrand Silver to improve the performance of ECAs, offering a more efficient solution for conductive adhesives used in electronics manufacturing.