The Quarter Factor Prediction of Mold Void Mechanism between Structure Ratio and Molding Gate

The fluid kinematics of epoxy molding compound effect on the flow behavior of transfer molding, melting wave uniformity and the mold void risk in the molding gate and structure ratio were analyzed and the molding resistance was investigated by the simulation and experiment as well in this article. The numerical method in this study was capable of considering the effects location on the melting trap of the void, and also compared with the molding resistance. Due to the variation of molding gate in device design period, the substrate type of molding process validation involves flow ability and molding structure resistance, which caused incomplete filling and popcorn failure. Thus, the prediction of melting wave and mold void distributions is a prerequisite for the reliability analysis of IC packages. However, it was demonstrated that the molding gate cross-sectional area ratio between gate and first-row package array affected the melting wave contribution, and deviated void across the chip. In addition, the die thickness and components aspect ratio influenced the potential mold void distribution on edge and packages of the entire strip. The result also showed better melting wave contact between fluid welding effects when the aspect ratio about 10%.