Solder Joint Reliability of Glass Core Substrate Assembly
The thermal-fatigue reliability of flip chip micro solder joints on glass core build-up package substrate and C4 (controlled collapse chip connection) solder joints on printed circuit board (PCB) is investigated. Emphasis is placed on the structural deformation and the accumulated inelastic strain at the critical locations of the micro and C4 solder joints. Some recommendations are also provided.
Authors
- John H. Lau (ORCID: https://orcid.org/0000-0003-1284-8829)
- Tzyy-Jang Tseng
- Mike Ma
- Ning Liu (ORCID: https://orcid.org/0000-0001-8399-8985)
Institutions
- Micron Corporation (United States) (US)
Publication Details
- Journal
- IMAPSource Proceedings
- Published
- 2025-02-07
- DOI
- https://doi.org/10.4071/001c.129522
- Citations
- 2
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 1.46