Ultra-Precise Dispensing in 3D Packaging: A Seamless Shift from R&D to Production
Additive manufacturing (AM) opens up a world of possibilities for creating next-generation electronics. However, employing AM technologies in microfabrication presents its own unique set of challenges. The ongoing trend towards miniaturization necessitates the printing of ultra-thin, high-density conductive interconnections in 3D packages and heterogeneous systems. In the presentation, we will showcase how the innovative technology of Ultra-Precise Dispensing (UPD) effectively addresses these challenges, how this microfabrication process is already used in advanced R&D and prototyping projects, and our current approach towards the use of the UPD approach in large-scale manufacturing.
Authors
- Aneta Wiatrowska
- Mateusz Łysień
- Piotr Kowalczewski
- Nina Szczotka
- Aleksandra Chudzyńska
- Łukasz Witczak (ORCID: https://orcid.org/0000-0003-2188-7037)
- Antoni Szczurek (ORCID: https://orcid.org/0000-0001-5247-8442)
- Aleksandra Motyka
- Aleksandra Perczyńska
Institutions
- Wrocław University of Science and Technology (PL)
- Polish Academy of Sciences (PL)
Publication Details
- Journal
- IMAPSource Proceedings
- Published
- 2025-02-13
- DOI
- https://doi.org/10.4071/001c.129769
- Primary Topic
- Additive Manufacturing and 3D Printing Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Industrial Technology Research Institute