Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures

The ever-increasing demand for miniaturization in semiconductor and microelectronic packaging is pushing the limits of what is feasible. On the design side, limitations such as space for keep-out zones (e.g. space for the fillet or the dispensing area of an underfill) and the potential flow of encapsulation compounds should not be overlooked in order to avoid contamination of surrounding components. In addition, optical barriers in sensors can often only be achieved using mold structures or by placing barriers (e.g. caps). It is generally preferred that these barriers are narrower and flatter, but this is often limited due to manufacturing reasons. With line widths of 100 μm and less combined with aspect ratios of above 5, DELO Industrial Adhesives, in cooperation with micro dispensing equipment manufacturer NSW Automation, has succeeded in developing a micro dam that creates new possibilities in the field of heterogeneous integration and optical packaging. High dispensing speeds and curing via UV light or heat also make the application process more flexible. Almost limitless designs of free-form structures are thus now possible and completely new package designs can be realized.