More chip circuit board heat dissipation structure design and analysis

With regard to the heating problem of high-speed FPGA (Field Programmable Gate Array) development board, this paper designs two heat dissipation structures, water-cooled heat dissipation and air-cooled heat dissipation, using modeling and simulation to effectively heat dissipation of multiple chips on the development board, and finally analyzes chip temperature data under steady state. The excellent performance of the water-cooled cooling scheme is verified by the data of air-cooled cooling. It has been proved that the water cooling system designed in this paper has higher efficiency and better cooling effect than the air cooling system, and can effectively solve the heat dissipation problem of the circuit board.