Implementation of Edge Coupled Bandpass Filter on MnM Interposer
This work presents an edge-coupled band-pass filter on a metallic-nanowire membrane (MnM) interposer for 60 GHz millimeter-wave (mmW) applications. The MnM interposer, utilizing nanoporous copper technology, serves as a substrate for 3D integrated circuits, enabling efficient interconnections in system-on-chip (SoC) designs. The proposed filter achieves wideband operation with simulated and measured impedance bandwidths of 6.70 GHz and 7.74 GHz, respectively, and insertion losses of 3.14 dB and 3.65 dB at 60 GHz.
Authors
- Luis Alexandre S Tapia
- Ariana L. C. Serrano (ORCID: https://orcid.org/0000-0002-7623-9910)
- Gustavo P. Rehder (ORCID: https://orcid.org/0000-0002-0340-126X)
- Gustavo dos Santos Rosa (ORCID: https://orcid.org/0000-0002-7444-4523)
- Raul O. Ribeiro (ORCID: https://orcid.org/0000-0003-3836-8081)
- Ivan Aldaya (ORCID: https://orcid.org/0000-0002-7969-3051)
- Rafael A. Penchel (ORCID: https://orcid.org/0000-0002-7298-4518)
- Helton Silva Bernardo (ORCID: https://orcid.org/0000-0002-8247-3906)
Institutions
- Institut polytechnique de Grenoble (FR)
- Centre National de la Recherche Scientifique (FR)
- Universidade de São Paulo (BR)
- Universidade Estadual Paulista (Unesp) (BR)
- Université Grenoble Alpes (FR)
Publication Details
- Published
- 2024-12-01
- DOI
- https://doi.org/10.1109/lacap63752.2024.10876240
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Fundação de Amparo à Pesquisa do Estado de São Paulo
- Conselho Nacional de Desenvolvimento Científico e Tecnológico