Experimental study on microstructure enhanced heat transfer performance of flat plate heat pipes
With the rise of edge computing, the heat dissipation of edge servers has increasingly become an important factor restricting the development of edge computing. As an efficient heat transfer component, flat heat pipes are one of the effective solutions to solve this problem. Therefore, there is an urgent need to find flat heat pipes with higher heat transfer performance.In this work, Three different surface structures were constructed on pure copper blocks using laser ablation and surface modification techniques, and were used as evaporation surfaces to investigate the effects of different structures on the heat transfer performance of flat heat pipes through experiments. Experiments have shown that the boiling heat transfer coefficient of the surface after laser ablation increased by $56.7 \%$ compared to the untreated surface, and the total thermal resistance decreased by $22 \%$ at a heat flux density of $150000 \mathrm{~W} / \mathrm{m}^{2}$. At the same time, the phase change process inside the phase change chamber of the flat heat pipe was explored through visualization research, revealing the mechanisms of evaporation condensation and microstructure enhanced heat transfer in the flat heat pipe, providing technical reference for the exploration of flat heat pipes in the future.
Authors
- Bo Sun (ORCID: https://orcid.org/0000-0003-3526-296X)
- Yubai Li (ORCID: https://orcid.org/0000-0001-8949-1122)
- Chunyang Peng
- Yi Sun (ORCID: https://orcid.org/0000-0002-8795-8160)
- Zhihua Ding (ORCID: https://orcid.org/0009-0000-5388-6122)
- Yongguang Wang
- Changzhao Fu
- Minli Bai
Institutions
- Dalian University of Technology (CN)
- Inspur (China) (CN)
Publication Details
- Published
- 2024-09-20
- DOI
- https://doi.org/10.1109/epee63731.2024.10875355
- Primary Topic
- Heat Transfer and Boiling Studies
- Type
- article
- Field-Weighted Citation Impact
- 0.00