Effect Of Anti-Epoxy Bleed Out Concentration And Leadframe Plating Condition Towards Die Attach Glue Bleed Out Performance

This technical paper is entitled "Effect of Anti-Glue Bleed Out (Anti-EBO) concentration and leadframe (LF) plating condition towards Die Attach glue bleed out performance". One of the main challenges faced by Die Attach (DA) process assembly manufacturing is glue bleed out (EBO). EBO is a phenomenon whereby there is separation of some formulation ingredients in the paste from its bulk paste, either reactive diluents, resins, catalysts, or additives, wetting leadframe surfaces adjacent to the die paddle area. As counter measure for EBO, leadframe surface will be treated and coated with anti-EBO solutions to prevent and control the resin from flowing into the leadframe and causing cosmetic and reliability issue. This technical paper aims to provide a better perspective in multiple factors that can affect glue bleed out during Die Attach process, such as anti EBO concentration and plating conditions and parameters used during lead frame manufacturing. The study was conducted by varying the concentration of anti-EBO coating applied to the leadframe surface, water rinse pump used, rinsing method, and dryer temperature of the leadframe. As response, the EBO performance was evaluated through visual inspection and measurement of glue bleed out spread. The results showed that the concentration of anti-EBO coating and some of plating conditions during leadframe manufacturing have a significant impact on the performance of glue bleed out. This paper highlights the importance of controlling the concentration of anti-EBO coating and the leadframe plating condition to improve the performance of glue bleed out at Die Attach process.