Die Cost Reduction Through Re-architecting Power Delivery Network Design and Enabling Common Package Footprint

This paper presents a comprehensive approach to achieve die cost reduction while enabling multiple innovative power delivery network (PDN) design techniques to preserve a common package footprint, which allows ‘one shot 2 kills’ savings for this project. A few significant challenges addressed in this study is the lowering of Metal-Insulator-Metal (MIM) Capacitance density, enabling the development of a solution with >4x lower MIM density at lower die cost. To address the complexities arising from MIMCAP reduction, an iterative methodology is employed to assess and mitigate power supply noise and cross-coupling effects in a disaggregated architecture. Feature enhancements such as improved noise isolation, optimized MIMCAP distribution, and adaptive PDN configurations are introduced to ensure robust performance under evolving market demands. The outcome of this research demonstrates that innovative PDN re-architecting can maintain power integrity (PI) performance within a negligible 5% delta.