Process Integration of Unique Identification Marks Using Inkjet Technologies for Backside Coating Tape

Semiconductors are used in many of the electronic devices for our daily lives, such as smartphones and personal computers, but counterfeit semiconductor packages have been increasing in recent years. Determination of authenticity in hardware as one of the measures has been required due to this trend. To prevent semiconductor counterfeiting, it is common to use laser marking to make logos, serial numbers, and other identifiers. In this case, X-ray or electrical response need to be used to determine whether the product is counterfeit or not. However, such methods are costly, making it difficult to analyze all semiconductor products. We propose an anti-counterfeiting solution which utilize unique identification mark with fine randomness in the ink impact minute droplet while printing. This method allows for the simple identification of counterfeit and also reduces costs compared to conventional methods, making it suitable for determining the authenticity of semiconductor products. In this study, we investigated the optimal process suitability for the construction of this technology. We prepared two kinds of backside coating tapes and two printing process; 1) printing before heat cured of backside coating tape, 2) printing after heat cured of backside coting tape. As a result, the samples of four conditions can be used as identifiable ID. On the other hand, no delamination happens to the printing before heat cured condition regardless of kinds of backside coating tapes. The test results indicate that the process printing before heat cured is the optimal process.