Developing a Simulation Model to Improve Strip Warpage Performance Predictability

Encapsulation is a process for protecting Die and Wire with protective material EMC. Elevated temperatures after the Post Encapsulation process may cause package warping—deviate from an ideal state of uniform planar flatness, commonly referred to as warpage/coplanarity. Actual warpage measurement only able to know after FUT (Functional Unit Test), and if value is more than specification of package design, it needs to be yield off and will have huge impacts on the entire development process in terms of cost and time to market. With improved technology, market needs for thinner die will be more prominent, and then the problems related to warpage will also be substantial. In such scenarios, having an algorithm or model that predicts strip warpage performance before FUT will be beneficial and can be mitigated earlier in the line. Hence, in this paper, we have used the bi-layer cantilever beam model (2D model) to predict the package warpage. We optimized, validated, and correlated it w.r.t. our data in order to stimulate the actual warpage performance of the package. Through advanced modelling techniques of MATLAB and SIMULINK, the research dwells on the major factors impacting warpage performance and hence seeks to enhance their predictability toward improving package designing.