Enhancement of 8mm Carrier Tape Sealing Performance for Small Diode (SOD) Package via Carrier Tape Material and Sealing Shoe Selection

The packing of electronic components, particularly small outline diode (SOD) packages, is a crucial aspect of the manufacturing process that significantly impacts product quality and reliability. Enhancing the sealing performance of 8mm carrier tapes for SOD packages through the selection of appropriate carrier tape materials and sealing shoe configurations is vital for reducing conversion costs. However, the intricate design of the 8mm carrier tape relative to larger packages presents unique performance challenges. This study aims to optimize the sealing process by carefully selecting carrier tape materials, specifically Polystyrene (PS) and Polycarbonate (PC), and configuring the sealing shoe using a Design of Experiments (DOE) approach. Results demonstrate that increasing the size of the sealing shoe imprint enhances peel strength but reduces the clearance for unsealing. Our findings identify the optimal carrier tape material and sealing shoe design, offering significant implications for improving efficiency and reliability in the electronics sector.