+Architecting for the first Low Power Double Data Rate 5 (LPDDR5) Memory Module

Low Power Compression Attached Memory Module 2 (LPCAMM2) is the first LPDDR memory module using Compressive Mounting technology which permits 60% less space on the motherboard, increases performance by 50% and energy efficiency by up to 70% compared to SODIMM. Intel partnering will Dell, has led the development of the module where, through JEDEC, they aligned with OEMs and module developers to carry out the first designs. Understanding the physical constraints of 2x SODIMM, efforts were made to architect the module's design to allow smooth technology transition towards LPCAMM2 without affecting existing laptop platform solutions. Work was done on defining the module size resulting in 78 mm x 23 mm with a 10-layer type-4 1.2 mm thick 2x2+ PCB that houses four LPDDR5 x32 SDRAM, and power delivery solutions. The top layer is used to place the SDRAM and power solution, the inner layers are used for memory and power routing. This solution supports 2-channel, 2-rank, byte mode support, 32 Gb density, and up to 9.6 GT/s bus speed in addition to new P5200 PMIC technology which features DVFSC/DVFSQ low power modes, register security, and overclocking. This paper will discuss in detail on LPCAMM2 attributes, and pathfinding work from the architecture phase to its realization into the market.