Compute Dynamic Random Access Memory (DRAM) Silicon Spacer Elimination - A Process Simplification Approach

This paper presents a novel approach to improve the efficiency of Compute DRAM packaging in the PCB industry. The current process involves the use of silicon spacers to fill defective boards, a process that consumes significant machine capacity and complicates the process. The paper introduces a unique heater block and window clamp design that eliminates the need for silicon spacers. The new design, rigorously tested, ensures good quality bonding and prevents energy losses. It also avoids potential abrasion and mechanical damage to the die backside, a challenge present in the previous design. The paper further discusses the testing methodology and results, demonstrating comparable performance with the standard setup in terms of wire pull, stitch pull, and bond shear. Assembly and test yields show no significant difference between the new design and the baseline performance. The paper concludes that the new design, passing all reliability tests, successfully simplifies the Compute DRAM packaging process without compromising quality, thereby meeting the increasing demand for memory and storage in today's industry. This innovative approach has the potential to significantly enhance manufacturing efficiency in the PCB industry.