Signal and Power integrity challenges in PCB for System-on-chip(SoC) based automotive applications and the need for chiplet based designs

In this paper, the challenges of signal and power integrity in PCB for integration of SoC based automotive applications IC’s are evaluated using market based EDA tools. Several key parameters like crosstalk, channel loss, timing, voltage drop, current density, Power distribution network and plane resonances are studied to investigate their impacts on the SI, PI and EMC performance in the PCB. The growing trend of the automotive industry needs customization, modularity, and scalability of IC for its performance. This paper also addresses the need for Chiplet based designs in the automotive industry.