Energy Saving in Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization

The growing emphasis on sustainable manufacturing processes and corporate social responsibility has led to increased interest in utilizing environmentally or eco-friendly and green chemicals that offer reduced hazards and greater sustainability. This shift is particularly evident in the exploration of alternatives to traditional chemical dipping deflashing processes used to eliminate excessive mold bleed resulting from molding operations. Assessment of excessive flashes typically relies on visual inspection and considers the impact of delamination on the leadframe to the mold compound interface. Conventionally, these processes utilize high-temperature, low flash point, water-soluble solvents, despite their drawbacks, including the generation of hazardous fumes and substantial electrical power demands for temperature control. This study delves into the feasibility of using lower temperature and no flash point chemicals to achieve comparable deflashing effectiveness without inducing delamination between the leadframe and mold compound. The findings reveal the potential to reduce chemical temperatures by up to 40 percent while still achieving effective deflashing results. This reduction in temperature not only mitigates the production of hazardous fumes but also diminishes the power requirements for heating during the deflashing process, thereby fostering a safer working environment. The adoption of such eco-friendly chemicals in deflashing processes aligns with broader sustainability objectives and corporate responsibility initiatives, offering both environmental benefits and improvements in operational efficiency.