Exploration on Miniaturization of Immersion Cooling Technology for Client Desktop and Edge Devices
Small Form Factor (SFF) systems often face thermal limitations due to the constraints of the chassis space. This paper aims to bring liquid immersion cooling technology into client/edge desktop segments, with the intent of miniaturization without trading off the performance. A self-contained liquid immersion cooling approach has been developed for desktop/IOT systems. The system chassis is designed with compartmentalization as a standalone form factor system. The heat source distribution, liquid flow, and the liquid cooling heat sink have been optimized. The prototyped solution has demonstrated a cooling capability of 650W, showing a path for Intel® Xeon® Scalable Processors family CPUs to get into a Small Form Factor (SFF) PC.
Authors
- B. Liu (ORCID: https://orcid.org/0009-0008-8223-7250)
- Khai Ern See
- Eng Kwong Lee
- Jia Yan Go
- Chun Keang Ooi
- Chin Kung Goh
- Cora Nien
Institutions
- Intel (United States) (US)
- Intel (Taiwan) (TW)
- Intel (Malaysia) (MY)
Publication Details
- Published
- 2024-10-16
- DOI
- https://doi.org/10.1109/iemt61324.2024.10875284
- Primary Topic
- Engineering Applied Research
- Type
- article
- Field-Weighted Citation Impact
- 0.00