PFAS free die attach for robust manufacturability of large body semiconductor packages

The recent regulation around PFAS has prompted many suppliers to rethink their offerings in terms of greener and sustainable solutions. In die attach, Quad Flat No lead (QFN) packages in large body format represent one of the steadiest growing types of chip carriers. Owing to their low profile, condensed form factor, high I/O and high thermal dissipation they are popular choices for chip set consolidation, miniaturization, and chips with high power density. There is demand for continued improvements in reliability of QFNs. Compatibility with flexible manufacturing and broad latitude performances are key areas that are critical for large body QFN type devices in Auto and RF markets.