Benchmarks for SPICE Modeling and Parameter Extraction Based on AI/ML

Over the past decades, the number of submitted articles that use numerical approaches for SPICE models or for characterization (extraction) of parameters of existing SPICE models has grown significantly. Many of those articles rely on synthetic data, generated either from technology computer-aided design (TCAD) or from physical SPICE model simulations; most do not model/fit measured data. Furthermore, those articles do not evaluate the physical correctness, smoothness/monotonicity, or asymptotic correctness of the approach they propose. That is sufficient for initial evaluation of proposed techniques. However, it does not prove that they are “industrial strength.” This article presents benchmarks/guidelines for the proposed artificial intelligence (AI)/machine learning (ML) SPICE modeling and characterization techniques to try to help them become practical and useful.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-02-13
DOI
https://doi.org/10.1109/ted.2025.3537952
Citations
10
Primary Topic
Neural Networks and Applications
Type
article
Field-Weighted Citation Impact
24.81
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Benchmarks for SPICE Modeling and Parameter Extraction Based on AI/ML

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Benchmarks for SPICE Modeling and Parameter Extraction Based on AI/ML

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article en
10 citations

Abstract

Over the past decades, the number of submitted articles that use numerical approaches for SPICE models or for characterization (extraction) of parameters of existing SPICE models has grown significantly. Many of those articles rely on synthetic data, generated either from technology computer-aided design (TCAD) or from physical SPICE model simulations; most do not model/fit measured data. Furthermore, those articles do not evaluate the physical correctness, smoothness/monotonicity, or asymptotic correctness of the approach they propose. That is sufficient for initial evaluation of proposed techniques. However, it does not prove that they are “industrial strength.” This article presents benchmarks/guidelines for the proposed artificial intelligence (AI)/machine learning (ML) SPICE modeling and characterization techniques to try to help them become practical and useful.

IEEE Transactions on Electron DevicesVol. 72(4)
NXP (Netherlands) (NL), Taiwan Semiconductor Manufacturing Company (Taiwan) (TW), Indian Institute of Technology Kanpur (IN)
Zero hunger
Openalex Percentile: Top 1%
Neural Networks and Applications
24.81
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