Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks
Editor’s notes: The emergence of heterogeneous integration (HI) and advanced integrated circuit (IC) packaging significantly improves device performance; however, it concurrently amplifies susceptibility to probing attacks, thereby necessitating the establishment of new security assessment standards. This article presents a quantitative framework designed for the evaluation of these vulnerabilities, bolstered by empirical analysis and discussions regarding potential countermeasures.—Kanad Basu, University of Texas at Dallas, USA
Authors
- Nelson Hastings
- Nitin Varshney
- M Shafkat M Khan (ORCID: https://orcid.org/0000-0002-8532-8720)
- Liton Kumar Biswas (ORCID: https://orcid.org/0000-0002-3260-5915)
- Navid Asadizanjani (ORCID: https://orcid.org/0000-0002-7097-4463)
- Himanandhan Reddy Kottur
- Rouhan Noor
Institutions
- National Institute of Standards and Technology (US)
- University of Wisconsin–Madison (US)
- University of Florida (US)
Publication Details
- Journal
- IEEE Design and Test
- Published
- 2025-02-13
- DOI
- https://doi.org/10.1109/mdat.2025.3541192
- Citations
- 4
- Primary Topic
- Physical Unclonable Functions (PUFs) and Hardware Security
- Type
- article
- Field-Weighted Citation Impact
- 9.08
Funders
- National Institute of Standards and Technology