Enhanced Dielectric Strength and Mechanical Properties in PMIA Micro-Nano Paper by Interface Plasma Fluorination Treatment

Poly(m-phenylene isophthalamide) (PMIA) is renowned for its superior insulating and mechanical properties, holding immense promise in ultrahigh-voltage transmission systems. To further enhance the mechanical robustness of nanofiber-based paper, microfibers have been employed as reinforcement fillers. However, interfacial issues have emerged as a challenge, compromising the insulation properties. In this work, we present the realization of synergistically enhanced breakdown strength and mechanical properties in the PMIA micro-nano composite paper, achieved by interface fluorination treatment. With an optimized fluorination time of 60 s, the composite structure becomes more compact, greatly enhancing its overall integrity. The fluorine-rich interface provides potential electron traps and hydrogen bond sites, which play a crucial role in enhancing both electrical insulation and mechanical properties. The breakdown strength is increased by 19.5%, achieving a high value of 295.6 kV/mm. Concurrently, Young’s modulus and tensile strength are enhanced to 4.04 GPa and 24.38 MPa with increases of 32.9% and 14.8%, respectively. However, it is noteworthy that excessive plasma fluorination can induce surface structural damage to microfibers, impeding the adhesion of nanofibers. It leads to a deterioration in both electrical and mechanical properties. Moreover, the optimized paper shows exceptional flexibility, foldability, and colorability, opening new avenues for their utilization in demanding electrical environments.

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Publication Details

Journal
IEEE Transactions on Dielectrics and Electrical Insulation
Published
2025-02-13
DOI
https://doi.org/10.1109/tdei.2025.3542011
Citations
2
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.85

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article

Enhanced Dielectric Strength and Mechanical Properties in PMIA Micro-Nano Paper by Interface Plasma Fluorination Treatment

Zixuan Zhao, Geng Chen, Xiang Yu, Kaixuan Sun et al.
2 citations
IEEE Transactions on Dielectrics and Electrical Insulation
Copper Interconnects and Reliability
0.85
article

Enhanced Dielectric Strength and Mechanical Properties in PMIA Micro-Nano Paper by Interface Plasma Fluorination Treatment

Zixuan Zhao, Geng Chen, Xiang Yu, Kaixuan Sun, Xianghan Du, Haoxuan Sun, Fangcheng Lv
article en
2 citations

Abstract

Poly(m-phenylene isophthalamide) (PMIA) is renowned for its superior insulating and mechanical properties, holding immense promise in ultrahigh-voltage transmission systems. To further enhance the mechanical robustness of nanofiber-based paper, microfibers have been employed as reinforcement fillers. However, interfacial issues have emerged as a challenge, compromising the insulation properties. In this work, we present the realization of synergistically enhanced breakdown strength and mechanical properties in the PMIA micro-nano composite paper, achieved by interface fluorination treatment. With an optimized fluorination time of 60 s, the composite structure becomes more compact, greatly enhancing its overall integrity. The fluorine-rich interface provides potential electron traps and hydrogen bond sites, which play a crucial role in enhancing both electrical insulation and mechanical properties. The breakdown strength is increased by 19.5%, achieving a high value of 295.6 kV/mm. Concurrently, Young’s modulus and tensile strength are enhanced to 4.04 GPa and 24.38 MPa with increases of 32.9% and 14.8%, respectively. However, it is noteworthy that excessive plasma fluorination can induce surface structural damage to microfibers, impeding the adhesion of nanofibers. It leads to a deterioration in both electrical and mechanical properties. Moreover, the optimized paper shows exceptional flexibility, foldability, and colorability, opening new avenues for their utilization in demanding electrical environments.

IEEE Transactions on Dielectrics and Electrical InsulationVol. 32(5)
North China Electric Power University (CN)
National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities
Openalex Percentile: Top 31%
Copper Interconnects and Reliability
0.85
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