Enhanced Dielectric Strength and Mechanical Properties in PMIA Micro-Nano Paper by Interface Plasma Fluorination Treatment
Poly(m-phenylene isophthalamide) (PMIA) is renowned for its superior insulating and mechanical properties, holding immense promise in ultrahigh-voltage transmission systems. To further enhance the mechanical robustness of nanofiber-based paper, microfibers have been employed as reinforcement fillers. However, interfacial issues have emerged as a challenge, compromising the insulation properties. In this work, we present the realization of synergistically enhanced breakdown strength and mechanical properties in the PMIA micro-nano composite paper, achieved by interface fluorination treatment. With an optimized fluorination time of 60 s, the composite structure becomes more compact, greatly enhancing its overall integrity. The fluorine-rich interface provides potential electron traps and hydrogen bond sites, which play a crucial role in enhancing both electrical insulation and mechanical properties. The breakdown strength is increased by 19.5%, achieving a high value of 295.6 kV/mm. Concurrently, Young’s modulus and tensile strength are enhanced to 4.04 GPa and 24.38 MPa with increases of 32.9% and 14.8%, respectively. However, it is noteworthy that excessive plasma fluorination can induce surface structural damage to microfibers, impeding the adhesion of nanofibers. It leads to a deterioration in both electrical and mechanical properties. Moreover, the optimized paper shows exceptional flexibility, foldability, and colorability, opening new avenues for their utilization in demanding electrical environments.
Authors
- Zixuan Zhao (ORCID: https://orcid.org/0000-0001-7597-6575)
- Geng Chen (ORCID: https://orcid.org/0000-0003-1357-1294)
- Xiang Yu (ORCID: https://orcid.org/0000-0001-7377-1496)
- Kaixuan Sun (ORCID: https://orcid.org/0009-0005-1091-8741)
- Xianghan Du
- Haoxuan Sun (ORCID: https://orcid.org/0009-0007-9361-1036)
- Fangcheng Lv (ORCID: https://orcid.org/0009-0005-6080-9412)
Institutions
- North China Electric Power University (CN)
Publication Details
- Journal
- IEEE Transactions on Dielectrics and Electrical Insulation
- Published
- 2025-02-13
- DOI
- https://doi.org/10.1109/tdei.2025.3542011
- Citations
- 2
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.85
Funders
- National Natural Science Foundation of China
- Fundamental Research Funds for the Central Universities