3D imaging and measurement of transient process based on angularly multiplexing pulsed holographic technique with photopolymers
Multi-frame transient off-axis holographic recording technique based on high repetition frequency nanosecond or picosecond sequential pulsed YAG laser and thick photopolymer holographic recording material was proposed for the 3- D imaging and parameter measurement of high-speed microjet particle field loaded by focused pulse laser. Based on polyvinyl alcohol (PVA)/acrylamide photopolymer with high spatial resolution, high photosensitivity, high diffraction efficiency, good angular selectivity and low volumetric shrinkage, four angularly multiplexed holograms of pulse-laser loaded high-speed microjet particle field with 1 microsecond interval, which corresponded to recording frame frequency of 1 million frames/s, were successfully recorded. The transient process of forming, transforming and breakup of shock wave interface, and the 3-D microjet particle field were clearly reconstructed. The key parameters, such as particle size, number density, velocity, were derived by analyzing the reconstructed 3-D particle fields of transient holograms. We believe that the angularly multiplexing pulsed holographic recording system is expected to have good application prospects in the 3-D imaging and parameter measurement of transient processes such as high-speed microjet particle field, laser-induced plasma, shock wave flow field, etc.
Authors
- Yuxia Zhao (ORCID: https://orcid.org/0000-0001-5693-0694)
- Dongxu Yang (ORCID: https://orcid.org/0000-0001-5352-7197)
- Jianhua Zhu (ORCID: https://orcid.org/0000-0002-6659-8442)
- Zeren Li (ORCID: https://orcid.org/0000-0001-7792-9190)
- Yu Zhao (ORCID: https://orcid.org/0000-0002-1700-5399)
Institutions
- Sichuan University (CN)
- Institute of Optics and Electronics, Chinese Academy of Sciences (CN)
- Technical Institute of Physics and Chemistry (CN)
- Shenzhen Technology University (CN)
- Institute of Fluid Physics
Publication Details
- Published
- 2025-02-13
- DOI
- https://doi.org/10.1117/12.3059382
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Chinese Academy of Sciences