Design and Implementation of Multi-Channel Temperature Measurement System of Thermal Test Chip Based on Diode Temperature-Sensitive Arrays

When chips perform numerous computational tasks or process complex instructions, they generate substantial heat, potentially affecting their long-term reliability and performance. Thus, accurate and effective temperature measurement and management are crucial to ensuring chip performance and lifespan. This paper presents a multi-channel temperature measurement system based on a diode temperature-sensitive array thermal test chip (TTC). The thermal test chip accurately emulates the heat power and thermal distribution of the target chip, providing signal output through row and column address selection. The multi-channel temperature measurement system centers around a microcontroller and includes voltage signal acquisition circuits and host computer software. It enables temperature acquisition, storage, and real-time monitoring of 16 channels in a 4 × 4 array thermal test chip. During experiments, the system uses a constant current source to drive temperature-sensitive diodes, collects diode output voltage through multiplexers and high-precision amplification circuits, and converts analog signals to digital signals via a high-speed ADC. Data transmission occurs via the USB 2.0 protocol, with the host computer software handling data processing and real-time display. The test results indicate that the system accurately monitors chip temperature changes in both steady-state and transient thermal response tests, closely matching measurements from a semiconductor device analyzer, with an error of about 0.67%. Therefore, this multi-channel temperature measurement system demonstrates excellent accuracy and real-time monitoring capability, providing an effective solution for the thermal design and evaluation of high power density integrated circuits.