Impact of CF₄ Plasma Modification on the Dielectric Properties in Frequency Domain of XLPE

During the operation of cables, the damp phenomenon of XLPE is very common, which seriously affects the insulation performance of cables. In this paper, to improve the hydrophobicity and dielectric properties of XLPE, the DBD plasma modification technology of CF<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</inf> is used to treat XLPE, and the dielectric response method is utilized to study the insulating properties of the modified material. The modification of XLPE using CF<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</inf> can effectively improve the fluorine element content on the surface of the material, which also produces surface etching effect on the material during the treatment process, increases the surface roughness of the material and affects the hydrophilicity of the material surface. With the increase of processing time, the dielectric loss shows a trend of decreasing and then increasing. In order to obtain better dielectric properties of the material, the recommended low-pressure (1 kPa) CF4 DBD treatment time is 120 s or 240 s.