Steady state creep of the silver-tin TLP interconnections of power modules

Purpose This paper aims to investigate the steady-state creep of the multilayer Silver-Tin transient liquid phase (AgSn-TLP) interconnects of the power modules using experiments and constitutive modeling. Design/methodology/approach A series of engineered creep tests is executed at different temperatures and stress levels to produce creep strain versus time data. Accordingly, steady-state creep parameters are acquired through nonlinear regressions. Two steady-state creep relations, including hyperbolic sine and power laws, are created, and validated with measured data. Afterwards, numerical studies are executed to examine the thermomechanical response of the AgSn-TLP interconnects compared to other bond materials. Findings Generally, the AgSn- TLP interconnections showed higher resistance to the accumulation of creep strains, indicating their potential to perform efficiently in high temperature applications. Originality/value This paper models the steady-state creep response of the silver-tin TLP bonds using hyperbolic sine and power laws. These models are important for stress and strain analysis using numerical simulations.