Simulation of Microstructure Heat Transfer of Graphene Doped Epoxy Resin Matrix Composites
Based on establishing the mathematical model of parallel heat transfer, considering the coupling effect of the flow field, temperature field, and stress field, the mathematical model of parallel heat transfer is solved, and the heat transfer characteristics such as temperature field and heat flux of graphene-doped composites are predicted. The equivalent heat transfer boundary conditions were simplified, and the equivalent heat transfer model of graphene-doped epoxy resin matrix composites was numerically solved to obtain the equivalent heat transfer characteristics of graphene-doped epoxy resin matrix composites. Compare the results of the heat transfer mathematical model and equivalent heat transfer model, such as temperature rise curve, heat flux distribution, and other heat transfer characteristics, analyze the relative error of the heat transfer mathematical model, and verify the correctness of the established mathematical model.
Authors
- Shuang Qiu (ORCID: https://orcid.org/0000-0002-4192-3026)
- Xiaona Wei (ORCID: https://orcid.org/0000-0003-1954-4246)
Institutions
- Shandong University of Technology (CN)
Publication Details
- Published
- 2024-12-06
- DOI
- https://doi.org/10.1109/iciba62489.2024.10868003
- Primary Topic
- Epoxy Resin Curing Processes
- Type
- article
- Field-Weighted Citation Impact
- 0.00