Application of Fuzzy Theory to Parameter Design in Wafer Stealth Laser Dicing

The application of fuzzy theory in stealth laser dicing technology for wafers aims to enhance the precision and efficiency of cutting parameters. With technological advancements and the growth of the electric vehicle industry, the demand for semiconductor chips has rapidly increased, driving wafer cutting technology towards greater efficiency and precision. Compared to traditional blade cutting and laser cutting techniques, stealth laser dicing technology can avoid the chipping caused by blade cuts and the thermal damage caused by laser cuts, providing a stress-free and thermal damage-free solution. This study optimizes cutting parameters through a fuzzy control system using a layered setting method. The first layer determines the most suitable laser power based on the thickness of the workpiece and the metal layer; the second layer uses the final wafer thickness and the laser power determined in the first layer as inputs to calculate the optimal scribing height. These parameter settings aim to enhance cutting quality and efficiency while also verifying the practical application effects of the fuzzy control system. Experimental results show that the fuzzy control system significantly improves cutting precision and efficiency, achieving a $100 \%$ cutting success rate, a ${6 6 \%}$ reduction in material consumption, a 4% reduction in energy usage, and a $50 \%$ reduction in parameter adjustment labor time. The precision of the fuzzy control system in controlling laser power surpasses manual settings, and the optimization of scribing height is also significantly improved. The study demonstrates that fuzzy theory has extensive potential applications in stealth laser dicing of wafers. Future research may integrate artificial intelligence technology to further enhance the automation of cutting parameter settings, thereby improving production efficiency and product quality.