Mask‐Free Direct Printing of Highly Customizable, Conformable, Robust, and Recyclable Microelectrodes for Advanced Curvy Electronics

Highly conformal and mechanically robust curvy electronics that seamlessly adapt to sophisticated and unpredictable 3D geometries provide breakthrough solutions in advanced fields such as health monitoring, wireless energy transmission, and human-computer interface. Nevertheless, existing material choices along with manufacturing techniques substantially impede these electronics from achieving their full potential. This study presents a mask-free and straightforward direct writing and transfer (DW&T) technique that employs a polytetrafluoroethylene film as a temporary substrate, utilizing the phase transition of printed electrodes between hydrogel and dry states to enable cost-effective fabrication of conformally adhering conductive microelectrode patterns on nearly all 3D surfaces. The resultant microelectrodes demonstrate extensively adjustable feature dimensions (linewidth 50-400 µm; height 0.07-2.3 µm; pitch 20 µm in minimum) and possess distinct electrical and optical characteristics, in addition to exhibiting significant stability under severe bending and stretching strains and recyclability. To demonstrate the capabilities of the DW&T, imperceptible and customizable substrate-free electronic skin (e-skin) on human skin is developed. The e-skin maintains ultraconformal and seamless contact with the skin, does not impede the natural sensations and physiological changes of its hosts, and achieves high-fidelity recording of diverse electrophysiological signals.

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Publication Details

Journal
Small
Published
2025-02-07
DOI
https://doi.org/10.1002/smll.202410201
Citations
6
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
4.04

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article

Mask‐Free Direct Printing of Highly Customizable, Conformable, Robust, and Recyclable Microelectrodes for Advanced Curvy Electronics

Fengxian Gao, Dongrui Wang, Yazheng Liu, Xiang Lin et al.
6 citations
Small
Advanced Sensor and Energy Harvesting Materials
4.04
article

Mask‐Free Direct Printing of Highly Customizable, Conformable, Robust, and Recyclable Microelectrodes for Advanced Curvy Electronics

Fengxian Gao, Dongrui Wang, Yazheng Liu, Xiang Lin, Liancong Yue, Jianping Wang, Liang Zhang, Min Gong, Xiangyi Kong
article en
6 citations

Abstract

Highly conformal and mechanically robust curvy electronics that seamlessly adapt to sophisticated and unpredictable 3D geometries provide breakthrough solutions in advanced fields such as health monitoring, wireless energy transmission, and human-computer interface. Nevertheless, existing material choices along with manufacturing techniques substantially impede these electronics from achieving their full potential. This study presents a mask-free and straightforward direct writing and transfer (DW&T) technique that employs a polytetrafluoroethylene film as a temporary substrate, utilizing the phase transition of printed electrodes between hydrogel and dry states to enable cost-effective fabrication of conformally adhering conductive microelectrode patterns on nearly all 3D surfaces. The resultant microelectrodes demonstrate extensively adjustable feature dimensions (linewidth 50-400 µm; height 0.07-2.3 µm; pitch 20 µm in minimum) and possess distinct electrical and optical characteristics, in addition to exhibiting significant stability under severe bending and stretching strains and recyclability. To demonstrate the capabilities of the DW&T, imperceptible and customizable substrate-free electronic skin (e-skin) on human skin is developed. The e-skin maintains ultraconformal and seamless contact with the skin, does not impede the natural sensations and physiological changes of its hosts, and achieves high-fidelity recording of diverse electrophysiological signals.

SmallVol. 21(10)
University of Science and Technology Beijing (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 7%
Advanced Sensor and Energy Harvesting Materials
4.04
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